AD9444

Rev. 0 | Page 8 of 40

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

With

Respect to

Min

Max

Unit

ELECTRICAL

AVDD1

AGND

−0.3

+4

V

AVDD2

AGND

−0.3

+6

V

DRVDD

DGND

−0.3

+4

V

AGND

DGND

−0.3

+0.3

V

AVDD1

DRVDD

−4

+4

V

AVDD2

DRVDD

−4

+6

V

AVDD2

AVDD1

−4

+6

V

D0 to D13

DGND

–0.3

DRVDD + 0.3

V

CLK, MODE

AGND

–0.3

AVDD1 + 0.3

V

VIN+, VIN−

AGND

–0.3

AVDD2 + 0.3

V

VREF

AGND

–0.3

AVDD1 + 0.3

V

SENSE

AGND

–0.3

AVDD1 + 0.3

V

REFT, REFB

AGND

–0.3

AVDD1 + 0.3

V

ENVIRONMENTAL

Storage Temperature

–65

+125

°C

Operating Temperature Range

–40

+85

°C

Lead Temperature Range

(Soldering 10 sec)

300

°C

Junction Temperature

150

°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Thermal Resistance

The heat sink of the AD9444 package must be soldered to

ground.

Table 6.

Package Type

Unit

100-Lead TQFP/EP

19.8

8.3

2

°C/W

board in still air.

in still air.

the thermal resistance through heat-sink path.

more metal directly in contact with the package leads, from

metal traces, through holes, ground, and power planes, reduces

the ground plane.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features proprie-

tary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic

discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of

functionality.