L6364 datasheet(52/60 Pages) STMICROELECTRONICS

部品番号	L6364

部品情報	Dual channel transceiver IC for SIO and IO-Link sensor applications

PDF	60 Pages

Scroll/Zoom	100%

メーカー	STMICROELECTRONICS [STMicroelectronics]

ホームページ	http://www.st.com

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52 / 60 page

CSP19 Package and Packaging Mechanical Data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages

have a Lead-free second level interconnect. The category of second level interconnect is marked on the package

and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to

soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com

Figure 28. CSP19 Mechanical drawings

Table 35. CSP19 Dimensions [mm]

SYMBOL

MIN.

TYP.

MAX.

0.414

0.444

0.474

0.179

0.194

0.209

0.225

0.250

0.275

0.239

0.269

0.299

2.507

2.537

2.567

2.507

2.537

2.567

1.8 BSC

1.5 BSC

0.45 BSC

0.50 BSC

0.006 BSC

0.172 BSC

fD1

0.374 BSC

fD2

0.363 BSC

fE1

0.441 BSC

L6364

CSP19 Package and Packaging

Mechanical Data

DS13363 - Rev 4

page 52/60

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