L6364 datasheet(41/60 Pages) STMICROELECTRONICS

部品番号	L6364

部品情報	Dual channel transceiver IC for SIO and IO-Link sensor applications

PDF	60 Pages

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メーカー	STMICROELECTRONICS [STMicroelectronics]

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Power dissipation

Figure 18 shows an example how to estimate the device junction temperatures based on the dissipation of

the regulator and switches. Since the thermal performance in the final application is dependant on a number

of factors (e.g. PCB design, power dissipation of neighbouring components, ambient temperature, air flow. bump-

pitch etc), the thermal package properties provided in the figure below should only serve as a guideline.

Figure 18. Example of thermal power dissipation estimation

The maximum average power consumption per channel (CQ or DIO) in short-circuit is:

ISAT(MAX) × VVPLUS(MAX)× tSHORT × NRETRY / tRESTART = 13.4 mW

In case of inductive load, the power dissipation (assuming no internal losses in the inductor itself) is :

P= 12 fSW ×L × I2 ,

where fSW is the switching frequency, L the load inductance and I the operating current. The design of the

application hardware (heat-sink capability) should take account of this heating.

L6364

Power dissipation

DS13363 - Rev 4

page 41/60

L6364 データシート(PDF) 41 Page - STMicroelectronics