RA4E2 datasheet(21/90 Pages) RENESAS

21 / 90 page

Table 2.6

I/O VOH, VOL, and other characteristics (2 of 2)

Parameter

Symbol Min

Typ

Max

Unit

Test conditions

Pull-up current serving

as the SCL current

source

I3C*4

ICS

—

VCC = 3.0 to 3.6 V

Vin = 0.3 × VCC to 0.7 × VCC

Input capacitance

Ports P003, P014,

P015,P814, P815

Cin

—

Vbias = 0 V

Vamp = 20 mV

f = 1 MHz

Ta = 25°C

Other input pins

—

Note 1. SCL0_A, SCL0_B, SCL0_C, SDA0_A, SDA0_B, and SDA0_C (total 6 pins).

Note 2. I3C_SCL/SCL0_D, I3C_SDA/SDA0_D (total 2 pins).

Note 3. This is the value when high driving ability is selected in the Port Drive Capability bit in the PmnPFS register. The selected driving

ability is retained in Deep Software Standby mode.

Note 4. I3C_SCL/SCL0_D (1 pin). This is the value when IIC high speed mode is selected.

2.2.5

Operating and Standby Current

Table 2.7

Operating and standby current (1 of 2)

Parameter

Symbol

Min Typ

Max

Unit Test conditions

Supply

current*1

High-speed

mode

Maximum*2 *13

ICC*3

—

ICLK = 100 MHz

PCLKA = 100

MHz

PCLKB = 50 MHz

PCLKC = 50 MHz

PCLKD = 100

MHz

FCLK = 50 MHz

CoreMark®*5 *6 *12

—

8.2

—

Normal mode

All peripheral clocks enabled,

while (1) code executing from

flash*4 *12

—

13.5

—

All peripheral clocks disabled,

while (1) code executing from

flash*5 *6 *12

—

9.1

—

Sleep mode*5

—

5.3*6

*12

42*7

*13

Increase

during BGO

operation

Data flash P/E

—

Code flash P/E

—

Low-speed mode*5 *10

—

1.8

—

ICLK = 1 MHz

Subosc-speed mode*5 *11

—

1.6

—

ICLK = 32.768

kHz

Software Standby mode

SNZCR.RXDREQEN = 1

—

SNZCR.RXDREQEN = 0

—

1.4

—

Deep

Software

Standby

mode

Power supplied to Standby SRAM and USB

resume detecting unit

—

µA

—

Power not

supplied to

SRAM or USB

resume

detecting unit

Power-on reset circuit low power

function disabled

—

25.6

—

Power-on reset circuit low power

function enabled

—

4.2

20.4

—

Increase when

the RTC and

AGT are

operating

When the low-speed on-chip

oscillator (LOCO) is in use

—

4.5

—

When a crystal oscillator for low

clock loads is in use

—

1.0

—

When a crystal oscillator for

standard clock loads is in use

—

1.4

—

Inrush current on returning from deep

software standby mode

Inrush current*8

IRUSH

—

160

—

Energy of inrush

current*8

ERUSH

—

1.0

—

µC

—

RA4E2 Datasheet

2. Electrical Characteristics

R01DS0413EJ0110 Rev.1.10

Feb 28, 2023

Page 21 of 90

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