Nexperia

PMPB20XPEA

20 V, P-channel Trench MOSFET

9. Thermal characteristics

Table 6. Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

[1]

-

235

270

K/W

Rth(j-a)

thermal resistance

from junction to

ambient

in free air

[2]

-

67

74

K/W

Rth(j-sp)

thermal resistance

from junction to solder

point

-

5

10

K/W

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm2.

017aaa542

tp (s)

10-3

102

103

10

1

10-2

10-1

102

10

103

Zth(j-a)

(K/W)

1

duty cycle = 1

0.75

0.5

0.33

0.25

0.2

0.1

0.05

0.02

0.01

0

FR4 PCB, standard footprint

Fig. 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

017aaa543

tp (s)

10-3

102

103

10

1

10-2

10-1

102

10

103

Zth(j-a)

(K/W)

1

duty cycle = 1

0.75

0.5

0.33

0.25

0.2

0.1

0.05

0.02

0.01

0

FR4 PCB, mounting pad for drain 6 cm2

Fig. 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

PMPB20XPEA

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Product data sheet

27 March 2018

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