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TAS5708 データシート(PDF) 7 Page - Texas Instruments |
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TAS5708 データシート(HTML) 7 Page - Texas Instruments |
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7 / 56 page ![]() ABSOLUTE MAXIMUM RATINGS DISSIPATION RATINGS (1) RECOMMENDED OPERATING CONDITIONS PWM OPERATION AT RECOMMENDED OPERATING CONDITIONS TAS5708 www.ti.com ........................................................................................................................................................................................... SLOS570 – DECEMBER 2008 over operating free-air temperature range (unless otherwise noted) (1) (2) VALUE UNIT DVDD, AVDD –0.3 to 3.6 V Supply voltage PVCC_X, AVCC –0.3 to 30 V 3.3-V digital inputs (except HIZ) –0.5 to DVDD + 0.5 V 3.3-V HIZ input –0.3 to AVDD + 0.3 V Input voltage 5-V tolerant(3) digital inputs (except MCLK) –0.5 to DVDD + 2.5(2) V 5-V tolerant MCLK input –0.5 to AVDD + 2.5(2) V OUT_x to PGND_X 32(4) V BST_x to PGND_X 43(4) V Operating free-air temperature 0 to 85 °C Operating junction temperature range 0 to 150 °C Storage temperature range, Tstg –40 to 125 °C (1) Stresses beyond those listed under absolute ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operation conditions are not implied. Exposure to absolute-maximum conditions for extended periods may affect device reliability. (2) Maximum pin voltage should not exceed 6.0V (3) 5-V tolerant inputs are PDN, RESET, SCLK, LRCLK, MCLK, SDIN, SDA, and SCL. (4) DC voltage + peak ac waveform measured at the pin should be below the allowed limit for all conditions. DERATING FACTOR TA ≤ 25°C TA = 45°C TA = 70°C PACKAGE ABOVE TA = 25°C POWER RATING POWER RATING POWER RATING 7-mm × 7-mm HTQFP 40 mW/°C 5 W 4.2 W 3.2 W (1) This data was taken using 1 oz trace and copper pad that is soldered directly to a JEDEC standard high-k PCB. The thermal pad must be soldered to a thermal land on the printed-circuit board. See TI Technical Briefs SLMA002 for more information about using the HTQFP thermal pad MIN NOM MAX UNIT Digital/analog supply voltage DVDD, AVDD 3 3.3 3.6 V Half-bridge supply voltage PVCC_X, AVCC 10 26 V VIH High-level input voltage Digital Inputs 2 V VIL Low-level input voltage Digital Inputs 0.8 V TA Operating ambient temperature range 0 85 °C TJ (1) Operating junction temperature range 0 125 °C RL (BTL) Load impedance Output filter: L = 33 µH, C = 1 µF. 6 8 Ω RL (PBTL) Load impedance Output filter: L = 33 µH, C = 1 µF. 3.2 4 Ω Minimum output inductance under 10 LO (BTL) Output-filter inductance µH short-circuit condition Minimum output inductance under 10 LO (PBTL) Output-filter inductance µH short-circuit condition (1) Continuous operation above the recommended junction temperature may result in reduced reliability and/or lifetime of the device. PARAMETER TEST CONDITIONS VALUE UNIT 11.025/22.05/44.1-kHz data rate ±2% 352.8 kHz Output sample rate 48/24/12/8/16/32-kHz data rate ±2% 384 Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Link(s): TAS5708 |
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