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MSS7341 データシート(PDF) 4 Page - Microchip Technology |
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MSS7341 データシート(HTML) 4 Page - Microchip Technology |
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4 / 38 page ![]() MCP16301 DS25004A-page 4 © 2011 Microchip Technology Inc. Thermal Shutdown Die Temperature TSD — 150 — °C Die Temperature Hysteresis TSDHYS — 30 — °C TEMPERATURE SPECIFICATIONS Electrical Specifications: Parameters Sym Min Typ Max Units Conditions Temperature Ranges Operating Junction Temperature Range TJ -40 — +125 °C Steady State Storage Temperature Range TA -65 — +150 °C Maximum Junction Temperature TJ — — +150 °C Transient Package Thermal Resistances Thermal Resistance, 6L-SOT-23 θ JA — 190.5 — °C/W EIA/JESD51-3 Standard DC CHARACTERISTICS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, T A = +25°C, VIN = VEN = 12V, VBOOST - VSW = 3.3V, VOUT = 3.3V, IOUT = 100 mA, L = 15 µH, COUT = CIN = 2 X 10 µF X7R Ceramic Capacitors Boldface specifications apply over the T A range of -40 oC to +85oC. Parameters Sym Min Typ Max Units Conditions Note 1: The input voltage should be > output voltage + headroom voltage; higher load currents increase the input voltage necessary for regulation. See characterization graphs for typical input to output operating voltage range. 2: For VIN < VOUT, VOUT will not remain in regulation. 3: VBOOST supply is derived from VOUT. |
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