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CY8C53 データシート(PDF) 100 Page - Cypress Semiconductor |
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CY8C53 データシート(HTML) 100 Page - Cypress Semiconductor |
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100 / 106 page ![]() PRELIMINARY PSoC® 5: CY8C53 Family Datasheet Document Number: 001-66237 Rev. *A Page 100 of 106 13. Packaging Figure 13-1. 68-Pin QFN 8x8 with 0.4 mm Pitch Package Outline (Sawn Version) Table 13-1. Package Characteristics Parameter Description Conditions Min Typ Max Units TA Operating ambient temperature –40 25 85 °C TJ Operating junction temperature –40 – 100 °C Tja Package θ JA (68-pin QFN) – 15 – °C/Watt Tja Package θ JA (100-pin TQFP) – 34 – °C/Watt Tjc Package θ JC (68-pin QFN) – 13 – °C/Watt Tjc Package θ JC (100-pin TQFP) – 10 – °C/Watt Table 13-2. Solder Reflow Peak Temperature Package Maximum Peak Temperature Maximum Time at Peak Temperature 68-pin QFN 260 °C 30 seconds 100-pin TQFP 260 °C 30 seconds Table 13-3. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Package MSL 68-pin QFN MSL 3 100-pin TQFP MSL 3 001-09618 *C [+] Feedback |
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