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SPC564A80L7 データシート(PDF) 144 Page - STMicroelectronics |
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SPC564A80L7 データシート(HTML) 144 Page - STMicroelectronics |
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144 / 157 page  Packages SPC564A74L7, SPC564A80B4, SPC564A80L7 144/157 Doc ID 15399 Rev 9 Table 54. PBGA324 package mechanical data Symbol mm inches MIN. TYP. MAX. MIN. TYP. MAX. A(1),(2),(3) 1. Max mounted height is 1.77mm.Based on 0.35mm ball pad diameter. Solder paste is 0.15mm thickness and 0.35mm diameter. 2. PBGA stands for Plastic Ball Grid Array. 3. The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metallized markings, or other feature of package body or integral heatslug. A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1corner. Exact shape of each corner is optional. 1.720 1.620 1.720 1.820 A1 0.270 0.350 0.400 0.450 A2 1.320 1.320 b 0.550 0.6000 0.650 0.550 0.600 0.650 D 22.80 23.00 23.200 22.900 23.000 23.100 D1 21.00 21.000 E 22.800 23.000 23.200 22.900 23.000 23.100 E1 21.000 21.000 e 0.950 1.000 1.050 0.950 1.000 1.050 f 0.875 1.000 1.125 0.875 1.000 1.125 ddd 0.200 0.200 |
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