MCP8021 datasheet(51/66 Pages) MICROCHIP

部品番号	MCP8021

部品情報	3-Phase Brushless DC (BLDC) Motor Gate Driver with Power Module, Sleep Mode, Op Amps

PDF	66 Pages

Scroll/Zoom	100%

メーカー	MICROCHIP [Microchip Technology]

ホームページ	http://www.microchip.com

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51 / 66 page

 2020-2024 Microchip Technology Inc. and its subsidiaries

DS20006265D-page 51

MCP8021/2

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

3.35

MILLIMETERS

0.50 BSC

MIN

MAX

4.90

Contact Pad Length (X28)

Contact Pad Width (X28)

0.85

0.30

Microchip Technology Drawing C04-2426 Rev D

NOM

Contact Pad Spacing

4.90

Contact Pad to Center Pad (X28)

0.35

Thermal Via Diameter

Thermal Via Pitch

0.33

1.20

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

ØV

SILK SCREEN

Contact Pad to Contact Pad (X24)

0.20

28-Lead Very Thin Plastic Quad Flat, No Lead Package (9PX) - 5x5 mm Body [VQFN]

With Stepped Wettable Flanks, 3.25x3.25mm Exposed Pad

0.20

MCP8021 データシート(PDF) 51 Page - Microchip Technology

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