MCP8021 datasheet(54/66 Pages) MICROCHIP

部品番号	MCP8021

部品情報	3-Phase Brushless DC (BLDC) Motor Gate Driver with Power Module, Sleep Mode, Op Amps

PDF	66 Pages

Scroll/Zoom	100%

メーカー	MICROCHIP [Microchip Technology]

ホームページ	http://www.microchip.com

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54 / 66 page

MCP8021/2

DS20006265D-page 54

 2020-2024 Microchip Technology Inc. and its subsidiaries

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

4.70

3.20

MILLIMETERS

0.65 BSC

MIN

MAX

Contact Pad Length (X28)

Contact Pad Width (X28)

1.50

0.45

NOM

Contact Pad Spacing

5.90

Contact Pad to Contact Pad (X26)

0.20

Thermal Via Diameter

Thermal Via Pitch

0.33

1.20

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Contact Pad to Center Pad (X28)

0.60

Microchip Technology Drawing C04-2521 Rev A

28-Lead Shrink Smal Outline Package (KEX) - 4.4 mm (.300 In.) Body [TSSOP]

With 3.1x4.6 mm Exposed Pad

SILK SCREEN

ØV

MCP8021 データシート(PDF) 54 Page - Microchip Technology

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