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MCP8021 データシート(PDF) 57 Page - Microchip Technology

部品番号 MCP8021
部品情報  3-Phase Brushless DC (BLDC) Motor Gate Driver with Power Module, Sleep Mode, Op Amps
PDF  66 Pages
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メーカー  MICROCHIP [Microchip Technology]
ホームページ  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP8021 データシート(HTML) 57 Page - Microchip Technology

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 2020-2024 Microchip Technology Inc. and its subsidiaries
DS20006265D-page 57
MCP8021/2
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
3.80
3.80
MILLIMETERS
0.40 BSC
MIN
E
MAX
5.00
Contact Pad Length (X40)
Contact Pad Width (X40)
Y1
X1
0.80
0.20
Microchip Technology Drawing C04-2425 Rev D
NOM
C1
Contact Pad Spacing
5.00
Contact Pad to Center Pad (X40)
G2
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
C1
EV
EV
C2 Y2
CH
E
X1
G1
Y1
ØV
G2
X2
Contact Pad to Pad (X36)
G1
0.20
Chamfer
CH
0.38
SILK SCREEN
40-Lead Very Thin Plastic Quad Flat, No Lead Package (NHX) - 5x5x0.9 mm Body [VQFN]
With 3.7x3.7 mm Exposed Pad and Wettable Flanks



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