STM32L100C6 datasheet(97/103 Pages) STMICROELECTRONICS

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STM32L100C6 STM32L100R8/RB

Package information

102

7.3

Thermal characteristics

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max × ΘJA)

Where:

•

TA max is the maximum ambient temperature in ° C,

•ΘJA is the package junction-to-ambient thermal resistance, in ° C/W,

•

PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

•

PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Figure 32. Thermal resistance

Table 62. Thermal characteristics

Symbol

Parameter

Value

Unit

ΘJA

Thermal resistance junction-ambient

LQFP64 - 10 x 10 mm / 0.5 mm pitch

°C/W

Thermal resistance junction-ambient

UFQFPN48 - 7 x 7 mm / 0.5 mm pitch

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