IMX8MPCEC datasheet(1/111 Pages) NXP

部品番号	IMX8MPCEC

部品情報	i.MX 8M Plus Applications Processor Datasheet for Consumer Products

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メーカー	NXP [NXP Semiconductors]

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NXP Semiconductors

Data Sheet: Technical Data

Document Number: IMX8MPCEC

Rev. 0, 03/2021

Ordering Information

See Table 3 on page 7

NXP reserves the right to change the production detail specifications as may be required

to permit improvements in the design of its products.

MIMX8ML8DVNLZAB

MIMX8ML6DVNLZAB

MIMX8ML4DVNLZAB

MIMX8ML3DVNLZAB

Package Information

Bare die Package

FCBGA 15 x 15 mm, 0.5 mm pitch

1

i.MX 8M Plus introduction

The i.MX 8M Plus family focuses on neural processing

unit (NPU) and vision system, advance multimedia, and

industrial automation with high reliability.

The i.MX 8M Plus is a powerful quad Arm® Cor-

tex®-A53 processor with speed up to 1.8 GHz inte-

grated with a NPU of 2.3 TOPS that greatly accelerate

machine learning inference. The vision engine is com-

posed of two camera inputs and a HDR-capable Image

Signal Processor (ISP) capable of 375 MPixels/s.

The advanced multimedia capabilities include 1080p60

video encode and decode H.265 and H.264. A 3D and

2D graphic acceleration supporting 1 GPixel/s,

OpenVG 1.1, Open GL ES3.1, Vulkan, and Open CL

1.2 FP. Multiple audio and microphone interfaces for

Immersive Audio and Voice systems.

For industrial applications, real time control is enabled

by an integrated 800 MHz Arm® Cortex®-M7. Robust

control networks are possible via CAN-FD interfaces.

And a dual Gb Ethernet, one supporting Time Sensitive

Networking (TSN), drive gateway applications with low

latency. High industrial system reliability for safety is

leveraged by DRAM Inline ECC as well as ECC sup-

port on internal software-accessible SRAMs.

i.MX 8M Plus Applications

Processor Datasheet for

Consumer Products

1.

i.MX 8M Plus introduction . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1.

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

1.2.

Ordering information . . . . . . . . . . . . . . . . . . . . . . . 7

2.

Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.1.

Unused input and output guidance . . . . . . . . . . . 14

3.

Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 18

3.1.

Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 18

3.2.

Power supplies requirements and restrictions . . . 34

3.3.

PLL electrical characteristics . . . . . . . . . . . . . . . . 36

3.4.

I/O DC parameters . . . . . . . . . . . . . . . . . . . . . . . 37

3.5.

I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . 39

3.6.

Output buffer impedance parameters . . . . . . . . . 41

3.7.

System modules timing . . . . . . . . . . . . . . . . . . . . 43

3.8.

External peripheral interface parameters . . . . . . 45

4.

Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 85

4.1.

Boot mode configuration pins . . . . . . . . . . . . . . . 85

4.2.

Boot device interface allocation . . . . . . . . . . . . . . 85

5.

Package information and contact assignments . . . . . . . 87

5.1.

15 x 15 mm package information . . . . . . . . . . . . 87

5.2.

DDR pin function list . . . . . . . . . . . . . . . . . . . . . 106

6.

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

同様の部品番号 - IMX8MPCEC

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