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EPC635 データシート(PDF) 13 Page - Espros Photonics corp |
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EPC635 データシート(HTML) 13 Page - Espros Photonics corp |
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13 / 97 page ![]() 3. Packaging and layout information 3.1. Mechanical dimensions The center of the effective pixel-field (160x60) is positioned with respect to the center of CSP pin 1 (XSYNC_SAT_CFG) with an offset of 2700µm by 1'000µm (x,y). This point corresponds to intersection of middle of columns C84 - C85 and middle of rows R36 - R37 when mapped to pixel-field coordinate system on the die (see Figure 29). The packaging technology is chip scale packaging (CSP). epc635 pixel-field 160 x 60 pixel Pixel size: 20µm x 20µm Top side view 1 2 3 4 5 6 7 9 38 39 25 24 23 22 21 20 40 37 27 28 29 30 31 32 33 34 18 17 16 15 14 13 12 10 35 36 44 26 41 8 11 19 43 42 (0.430) 0.500 2.700 5.500 (12 bumps with 0.5mm pitch) 6.26 +0.00/-0.08 3.200 R6 R65 Pin 1 0.185 ±0.025 (0.050) Figure 8: Mechanical dimensions Notes: ■ ■ all measures in mm ■ not specified tolerances: ±0.001mm ■ Dimensions in brackets: informal only ■ Top side is illumination side © 2017 ESPROS Photonics Corporation Characteristics subject to change without notice 13 / 97 Datasheet_epc635-V1.02 www.espros.com |
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