PIC16F15213 datasheet(15/439 Pages) MICROCHIP

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• Handling high-frequency noise: If the board is experiencing high-frequency noise (upward of tens of MHz),

add a second ceramic type capacitor in parallel to the above described decoupling capacitor. The value of the

second capacitor can be in the range of 0.01 μF to 0.001 μF. Place this second capacitor next to each primary

decoupling capacitor. In high-speed circuit designs, consider implementing a decade pair of capacitances as

close to the power and ground pins as possible (e.g., 0.1 μF in parallel with 0.001 μF).

• Maximizing performance: On the board layout from the power supply circuit, run the power and return traces to

the decoupling capacitors first, and then to the device pins. This ensures that the decoupling capacitors are first

in the power chain. Equally important is to keep the trace length between the capacitor and the power pins to a

minimum, thereby reducing PCB trace inductance.

4.2.2

Tank Capacitors

With on boards with power traces running longer than six inches in length, it is suggested to use a tank capacitor for

integrated circuits, including microcontrollers, to supply a local power source. The value of the tank capacitor may be

determined based on the trace resistance that connects the power supply source to the device, and the maximum

current drawn by the device in the application. In other words, select the tank capacitor that meets the acceptable

voltage sag at the device. Typical values range from 4.7 μF to 47 μF.

4.3

Master Clear (MCLR) Pin

The MCLR pin provides two specific device functions: Device Reset, and device programming and debugging. If

programming and debugging are not required in the end application, a direct connection to VDD may be all that

is required. The addition of other components, to help increase the application’s resistance to spurious Resets

from voltage sags, may be beneficial. A typical configuration is shown in Figure 4-1. Other circuit designs may be

implemented, depending on the application’s requirements.

During programming and debugging, the resistance and capacitance that can be added to the pin must be

considered. Device programmers and debuggers drive the MCLR pin. Consequently, specific voltage levels (VIH

and VIL) and fast signal transitions must not be adversely affected. Therefore, specific values of R1 and C1 will need

to be adjusted based on the application and PCB requirements. For example, it is recommended that the capacitor,

C1, be isolated from the MCLR pin during programming and debugging operations by using a jumper (Figure 4-2).

The jumper is replaced for normal run-time operations.

Any components associated with the MCLR pin may be placed within 0.25 inch (6 mm) of the pin.

Figure 4-2. Example of MCLR Pin Connections









VDD

MCLR

PIC® MCU

Rev. 30-000058A

4/5/2017

Notes:

R1 ≤ 10 kΩ is recommended. A suggested starting value is 10 kΩ. Ensure that the MCLR pin VIH and VIL

specifications are met.

R2 ≤ 470Ω will limit any current flowing into MCLR from the extended capacitor, C1, in the event of MCLR pin

breakdown, due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS). Ensure that the MCLR pin

VIH and VIL specifications are met.

4.4

In-Circuit Serial Programming

™ (ICSP™) Pins

The ICSPCLK and ICSPDAT pins are used for ICSP and debugging purposes. It is recommended to keep the trace

length between the ICSP connector and the ICSP pins on the device as short as possible. If the ICSP connector is

expected to experience an ESD event, a series resistor is recommended, with the value in the range of a few tens of

ohms, not to exceed 100Ω.

PIC16F15213/14/23/24/43/44

Guidelines for Getting Started with PIC16F152 Micr...

and its subsidiaries

Data Sheet

DS40002195E-page 15

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