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SPC58EN80C3RMSBY データシート(PDF) 154 Page - STMicroelectronics |
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SPC58EN80C3RMSBY データシート(HTML) 154 Page - STMicroelectronics |
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154 / 158 page  Revision history SPC584Nx, SPC58ENx, SPC58NNx 154/158 DS11734 Rev 6 12-Mar-2018 4 (cont’) Table 65: TxEN output characteristics: added table footnote “ Pad configured as VERY STRONG.” Table 66: TxD output characteristics,,: changed note 3 to apply to the whole table Chapter 4: Package information: Table 75: FPBGA292 package mechanical data: updated Amax formula in table footnote 2. Section 4.3: Package thermal characteristics Reformated note from introduction Table 77: Thermal characteristics for 292-pin BGA: Updated values for RθJA, RθJB and RθJC Chapter 5: Ordering information Table 79: RAM options: Updated PRAMC_2 start address Figure 51: Ordering information scheme: Removed reference to KGD. Table 81. Document revision history (continued) Date Revision Changes |
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