SPC58EN80C3RMSBY datasheet(156/158 Pages) STMICROELECTRONICS

156 / 158 page

Revision history

SPC584Nx, SPC58ENx, SPC58NNx

156/158

DS11734 Rev 6

04-June-2019

5 (Cont’)

Section 3.12.4: S/D ADC electrical specification:

– Minor format and editorial changes.

– Added note.

– Table 27: SDn ADC electrical specification:

Updated Max value before calibration for VOFFSET, IBIAS, IADV_D.

Updated footnote “S/D ADC is functional...”.

Added footnote “The absolute value...” for

|δGAIN|.

Added one line with Tj < 165°C for |δGAIN| and ΣIADR_D.

Updated Min value for Vcmrr.

Section 3.12.5: SD ADC filter modes

– Updated paragraph “In Bypass FIR mode...”.

– Removed Table 30: Digital output codes in full scale Bypass FIR mode.

– Added Table 29: Digital output codes in full scale.

Section 3.14: LFAST pad electrical characteristics

– Table 31: LVDS pad startup and receiver electrical characteristics,:

Updated footnote #12 starting with “Value valid for LFAST mode...” with new

sentence containing DSPI mode related data.

Removed the last sentence of Note “Total internal capacitance...”.

Section 3.16: Power management

– Table 38: External components integration:

Added unit to Max value for Cs2 and Cs1_A.

Updated Conditions for CBV.

– Table 41: SMPS Regulator specifications:

Changed condition for IDDSMPS.

– Table 42: Voltage monitor electrical characteristics: added footnote “Even if

LVD/HVD ...”.

Section 3.17: Flash memory

– Table 43: Wait State configuration: changed the minimum frequency from 40

to 55 MHz for APC=001.

Section 3.18: AC Specifications

– Table 47: Nexus debug port timing:

Updated Min values for tTCYC Absolute minimum TCK cycle time.

Updated Max value on line 15.

– Figure 20: Nexus output timing: deleted this figure.

– Section 3.18.3.7: RMII transmit signal timing (TXD[1:0], TX_EN): added Note

“RMII transmit ... as 1ns”.

Chapter 4: Package information

Minor format changes.

Section 4.1: eLQFP176 package information: updated section according latest

POA.

– Figure 52: FPBGA292 package outline: Minor format changes.

Section 4.3: Package thermal characteristics:

– Minor formatting changes.

– Table 77: Thermal characteristics for 176 exposed pad LQFP package:

updated values for

RθJA, RθJCtop, RθJMA and RθJB .

Table 81. Document revision history (continued)

Date

Revision

Changes

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