MPC5121E datasheet(22/86 Pages) FREESCALE

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MPC5121E/MPC5123 Data Sheet, Rev. 1

Electrical and Thermal Characteristics

Freescale Semiconductor

3.1.5

Power Dissipation

Power dissipation of the MPC5121e/MPC5123 is caused by 4 different components: the dissipation of the internal or core

digital logic (supplied by VDD_CORE), the dissipation of the analog circuitry (supplied by SYS_PLL_AVDD and

CORE_PLL_AVDD), the dissipation of the IO logic (supplied by VDD_MEM_IO and VDD_IO) and the dissipation of the

PHYs (supplied by own supplies). Table 9 details typical measured core and analog power dissipation figures for a range of

operating modes. However, the dissipation due to the switching of the IO pins can not be given in general, but must be calculated

for each application case using the following formula:

Eqn. 1

where N is the number of output pins switching in a group M, C is the capacitance per pin, VDD_IO is the IO voltage swing, f

is the switching frequency and PIOint is the power consumed by the unloaded IO stage. The total power consumption of the

MPC5121e/MPC5123 processor must not exceed the value, which would cause the maximum junction temperature to be

exceeded.

Eqn. 2

Table 9. Power Dissipation

Core Power Supply (VDD_CORE)

SpecID

Mode

High-Performance

Unit

e300 = 300 MHz, CSB = 200 MHz

Operational1,

1 Typical core power is measured at VDD_CORE = 1.4 V, Tj = 25 C.

NOTE

The maximum power depends on the supply voltage, process corner,

junction temperature, and the concrete application and clock

configurations.

The worst case power consumption could reach a maximum of 2000

mW.

800

D5.1

Deep-Sleep1,

1mW

D5.2

Hibernation

D5.3

PLL/OSC Power Supplies (SYS_PLL_AVDD, CORE_PLL_AVDD)

Typical

D5.4

Unloaded I/O Power Supplies (VDD_IO, VDD_MEM_IO)

Typical

300

D5.5

PHY Power Supplies (USB_VDDA, SATA_VDDA)

Typical

200

D5.6

IOint

∑

CVDD_IO

total

core

analog

PPHYs

Preliminary

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