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H8SX/1663M データシート(PDF) 31 Page - Renesas Technology Corp |
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H8SX/1663M データシート(HTML) 31 Page - Renesas Technology Corp |
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31 / 1504 page ![]() Rev. 2.00 Sep. 24, 2008 Page xxxi of xxxii 28.9.4 Timing Sequence at Power-On ....................................................................... 1280 28.10 Sleep Instruction Exception Handling ............................................................................ 1281 28.11 φ Clock Output Control................................................................................................... 1284 28.12 Usage Notes .................................................................................................................... 1285 28.12.1 I/O Port Status................................................................................................. 1285 28.12.2 Current Consumption during Oscillation Settling Standby Period ................. 1285 28.12.3 Module Stop State of EXDMAC, DMAC, or DTC ........................................ 1285 28.12.4 On-Chip Peripheral Module Interrupts ........................................................... 1285 28.12.5 Writing to MSTPCRA, MSTPCRB, and MSTPCRC ..................................... 1285 28.12.6 Control of Input Buffers by DIRQnE (n = 3 to 0)........................................... 1286 28.12.7 Conflict between a transition to deep standby mode and interrupts................ 1286 28.12.8 B φ/SDRAMφ Output State ............................................................................. 1286 Section 29 List of Registers .............................................................................1287 29.1 Register Addresses (Address Order)............................................................................... 1288 29.2 Register Bits.................................................................................................................... 1307 29.3 Register States in Each Operating Mode ........................................................................ 1339 Section 30 Electrical Characteristics ...............................................................1359 30.1 Absolute Maximum Ratings ........................................................................................... 1359 30.2 DC Characteristics H8SX/1668R Group ...................................................................... 1360 30.3 DC Characteristics H8SX/1668M Group...................................................................... 1363 30.4 AC Characteristics .......................................................................................................... 1367 30.4.1 Clock Timing .................................................................................................. 1367 30.4.2 Control Signal Timing .................................................................................... 1370 30.4.3 Bus Timing ..................................................................................................... 1371 30.4.4 DMAC and EXDMAC Timing....................................................................... 1402 30.4.5 Timing of On-Chip Peripheral Modules ......................................................... 1406 30.5 USB Characteristics ........................................................................................................ 1413 30.6 A/D Conversion Characteristics ..................................................................................... 1415 30.7 D/A Conversion Characteristics ..................................................................................... 1415 30.8 Flash Memory Characteristics ........................................................................................ 1416 30.9 Power-On Reset Circuit and Voltage-Detection Circuit Characteristics (H8SX/1668M Group) .................................................................................................... 1418 Appendix............................................................................................................1421 A. Port States in Each Pin State ........................................................................................... 1421 B. Product Lineup................................................................................................................ 1427 C. Package Dimensions ....................................................................................................... 1428 D. Treatment of Unused Pins............................................................................................... 1430 |
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