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MCP6V06T データシート(PDF) 39 Page - Microchip Technology |
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MCP6V06T データシート(HTML) 39 Page - Microchip Technology |
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39 / 44 page ![]() © 2008 Microchip Technology Inc. DS22093B-page 39 MCP6V06/7/8 APPENDIX A: REVISION HISTORY Revision B (December 2008) The following is the list of modifications: 1. Added the 8-lead, 2x3 TDFN package for the MCP6V01 and MCP6V03 devices. 2. Added 8-lead, 2x3 TDFN package information to Thermal Characteristic table. 3. Added information on the Exposed Thermal Pad (EP) for the 8-lead, 2x3 TDFN and 8-lead, 4x4 DFN packages. 4. Added Section 4.3.6 “Stabilizing Output Loads”. 5. Other minor typographical corrections. Revision A (June 2008) • Original Release of this Document. |
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