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MCP6V06T データシート(PDF) 19 Page - Microchip Technology |
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MCP6V06T データシート(HTML) 19 Page - Microchip Technology |
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19 / 44 page ![]() © 2008 Microchip Technology Inc. DS22093B-page 19 MCP6V06/7/8 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE 3.1 Analog Outputs The analog output pins (VOUT) are low-impedance voltage sources. 3.2 Analog Inputs The non-inverting and inverting inputs (VIN+, VIN–, …) are high-impedance CMOS inputs with low bias currents. 3.3 Power Supply Pins The positive power supply (VDD) is 1.8V to 5.5V higher than the negative power supply (VSS). For normal operation, the other pins are between VSS and VDD. Typically, these parts are used in a single (positive) supply configuration. In this case, VSS is connected to ground and VDD is connected to the supply. VDD will need bypass capacitors. 3.4 Chip Select (CS) Digital Input This pin (CS) is a CMOS, Schmitt-triggered input that places the MCP6V08 op amps into a low power mode of operation. 3.5 Exposed Thermal Pad (EP) There is an internal connection between the Exposed Thermal Pad (EP) and the VSS pin; they must be con- nected to the same potential on the Printed Circuit Board (PCB). This pad can be connected to a PCB ground plane to provide a larger heat sink. This improves the package thermal resistance (θJA). MCP6V06 MCP6V07 MCP6V08 Symbol Description TDFN SOIC DFN SOIC TDFN SOIC 661 16 6 VOUT, VOUTA Output (op amp A) 222 22 2 VIN–, VINA– Inverting Input (op amp A) 333 33 3 VIN+, VINA+ Non-inverting Input (op amp A) 444 44 4 VSS Negative Power Supply —— 5 5 —— VINB+ Non-inverting Input (op amp B) —— 6 6 —— VINB– Inverting Input (op amp B) —— 7 7 —— VOUTB Output (op amp B) 778 87 7 VDD Positive Power Supply —— —— — 8 CS Chip Select (op amp A) 1, 5, 8 1, 5, 8 — — 1, 5, 8 1, 5 NC No Internal Connection 9 — 9 — 9 — EP Exposed Thermal Pad (EP); must be connected to VSS |
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