R34DS0017EU0104 Rev.1.04

Page 36

Jan 31, 2025

ISL73041SEH Datasheet

LGL

11 (b)

2529.14

688.13

110

110

1.25

LGH

12 (a)

2529.14

943.20

110

110

1.25

LGH

12 (b)

2529.14

1193.42

110

110

1.25

PHS

13 (a)

2529.14

1448.71

110

110

1.25

PHS

13 (b)

2529.14

1698.42

110

110

1.25

UGL

14 (a)

2523.5

1954.00

110

110

1.25

UGL

14 (b)

2523.5

2204.00

110

110

1.25

UGH

15 (a)

2204.00

2529.14

110

110

1.25

UGH

15 (b)

1954.00

2529.14

110

110

1.25

BOOT

16 (a)

1504.48

2529.14

110

110

1.25

BOOT

16 (b)

1254.48

2529.14

110

110

1.25

SGND

PAD

169.99

175.36

110

110

1.25

1. Origin of coordinate is the bottom left hand corner of die.

2. Pads 9 through 16 have double bond pads denoted as (a) and (b). Pad number designation intentionally assigned to match package pin

number.

Table 3. Layout X-Y Coordinates (Centroid of Bond Pad)[1] (Cont.)

Pad Name

Pad

Number[2]

X Coordinate

(µm)

Y

Coordinate

(µm)

Pad X

Dimension

(µm)

Pad Y

Dimension

(µm)

Bond Wire Diameter

(0.001”)