33394 datasheet(40/44 Pages) FREESCALE

40 / 44 page

33394

MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA

PACKAGE DIMENSIONS

FC SUFFIX

44–LEAD QFN

PLASTIC PACKAGE

CASE 1310–01

ISSUE D

PIN 1

INDEX AREA

EXPOSED DIE

ATTACH PAD

6.55

6.85

44X 0.23

0.1

0.65

0.1

0.05

A B

44X

0.75

0.1

A B

0.1

A B

VIEW M–M

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETERS.

2. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

3. THE COMPLETE JEDEC DESIGNATOR FOR THIS

PACKAGE IS: HF–PQFP–N.

4. CORNER CHAMFER MAY NOT BE PRESENT.

DIMENSIONS OF OPTIONAL FEATURES ARE FOR

REFERENCE ONLY.

5. COPLANARITY APPLIES TO LEADS, CORNER

LEADS AND DIE ATTACH PAD.

6. FOR ANVIL SINGULATED QFN PACKAGES,

MAXIMUM DRAFT ANGLE IS 12

°.

40X

DETAIL M

PIN 1 IDENTIFIER

1.0 1.00

0.05

0.1

0.05

C SEATING PLANE

DETAIL G

VIEW ROTATED 90 CLOCKWISE

(0.65)

(0.325)

0.8 0.75

0.00

6.55

6.85

0.50

0.37

(3.53)

PREFERRED CORNER CONFIGURATION

DETAIL N

(0.25)

DETAIL N

CORNER CONFIGURATION OPTION

0.60

DETAIL M

PREFERRED BACKSIDE PIN 1 INDEX

DETAIL T

PREFERRED BACKSIDE PIN 1 INDEX

(90 )

DETAIL M

BACKSIDE PIN 1 INDEX OPTION

0.065

44X

(45 )

0.015

0.39

0.31

0.24

0.1

0.0

3.4

0.475

0.425

3.3

BACKSIDE

PIN 1 INDEX

0.25

0.15

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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